The finite element analysis on a two-stage semiconductor refrigeration device was carried out using the thermoelectric module in ANSYS Workbench software.The influences of the input voltage, hot end temperature, property of semiconductor unit, and properties of joint thermocouple arm and inter-stage thermal insulation materials on the cold end temperature and cooling capacity were studied.The simulation results show that the cold end temperature decreases with the increasing of input voltage when the hot end temperature keeps constant; the cold end temperature goes up with the increasing of hot end temperature when the input voltage keeps constant, which leads to the rising of cooling capacity;enlarging the height of semiconductor units and narrowing the spaces between them, and decreasing the thermal conductivity of joint couple arm and inter-stage insulation materials can lower the cold end temperature of semiconductor refrigerating device.The simulated results are in good agreement with the experimental results.